GENESIS Silicon 900 heat sink compound Thermal paste 12.8 W/m·K 2 g

The GENESIS Silicon 900 thermal paste is engineered to provide superior heat transfer, ensuring your high-performance components operate at optimal temperatures. This premium heat sink compound, weighing 2 grams, is essential for maintaining system stability and extending the lifespan of your valuable hardware.

Key Features & Benefits

• Exceptional Thermal Conductivity: Boasting a high thermal conductivity of 12.8 W/m·K, the Silicon 900 efficiently dissipates heat away from your CPU and GPU.
• Wide Operating Temperature Range: Designed to perform reliably across extreme conditions, it operates effectively from -50°C to 250°C.
• Optimal Density for Application: With a density of 2.8 g/cm³, this thermal paste ensures easy and precise application without the need for pre-baking.

Who It's For

This thermal paste is ideal for PC builders, gamers, and enthusiasts seeking to maximize cooling performance and stability for their desktop computers and laptops. It's perfect for new builds, upgrades, or routine maintenance to keep your system running cool under heavy loads.